Breakdown Analysis of Magnetic Flip-flop With 28nm UTBB FDSOI Technology - Télécom Paris Access content directly
Journal Articles IEEE Transactions on Device and Materials Reliability Year : 2016
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hal-02287471 , version 1 (13-09-2019)

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  • HAL Id : hal-02287471 , version 1

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Hao Cai, You Wang, Lirida Alves de Barros Naviner, Weisheng Zhao. Breakdown Analysis of Magnetic Flip-flop With 28nm UTBB FDSOI Technology. IEEE Transactions on Device and Materials Reliability, 2016, 16 (3), pp.376-383. ⟨hal-02287471⟩
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